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  • Product name: Thermal management graphite
  • Product Number: 009
  • Added time: 2010-05-06
  • Views : 172

As a new generation heat spreader material, thermal management graphite offers a unique combination of excellent heat stability, weight savings, high thermal conductivity, low coefficient of thermal expansion and anti-corrosion to the electronic thermal management industry. It outperforms the traditional heat spreader materials, such as aluminum, copper and so on. It has provided valuable thermal solutions in a variety of industries and applications, including handheld communication devices, LCD, PDP, LED, CPU, MPU, automobile electronics, power amplifier and other electronics. It will not only miniaturize the electronic components, but also save the weight, lower the cost, improve the safety, optimize the energy efficiency and prolong the operating life.

Programmable properties
● Engineered thermal conductivity (240-400 W/m.K) outperforms aluminum and copper.
● The property of orientable heat spread, i.e. high thermal conductivity in a-direction (the horizontal
  direction), low thermal conductivity in c-direction (through-thickness direction), benefits the heat
  shield and eliminates the effects on the surrounding electronic components. It is about 2 to 7 times
  thermal conductivity between these two directions.
● With bulk density of 1.70—1.90 g/cc, it is 30% lighter than aluminum and 80% lighter than copper.
  Therefore it can reduce the weight of the electronic components.
● Excellent heat stability, low coefficient of thermal expansion and performance reliable up to +400℃.
● Stable chemical properties, environment friendly and rustproof.

Typical Sizes
● 330×310×80mm
● 310×160×70mm
● Other dimensions are available on request.

Specifications

Grade
 
Bulk Density(g/cm3
 
Thermal Conductivity ( W/m.K )
a-direction
c-direction
ETMP-250
1.68min.
240-270
150-180
ETMP-350
1.85min.
350-400
40-60

* The values mentioned in this table are only for reference and not committed to any contract.